منابع مشابه
Electroless Nickel Plating: Bath Control
In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nic...
متن کاملMirror-Bright Silver Plating from a Cyanide-Free Bath
ilver has good electric conductivity and solderability and possesses S excellent electric characteristics as a contact and is thus widely used for plating electronic industrial parts. A cyanide plating bath is most often used, but the cyanide compounds have strong toxicity and a large amount of the cost is rxpkd for securing safe working conditions and waste treatment. Because of this, many cya...
متن کاملBath and Deposit Monitoring System for Electroless Nickel Plating Process
Electroless nickel plating is a widely used plating method in many industries. The usability of the coating is, however, restricted by the control problems related to the electroless nickel plating process. To ensure deposit quality, the transcendent properties of electroless nickel deposit should be accurately controlled during plating, which is challenging because of the spontaneous, unstable...
متن کاملCapillary Zone Electrophoresis for Electroless Plating Bath Samples
Capillary zone electrophoresis was used in the analysis of anions and cations in electroless plating bath samples. Examples described in this application note include the analysis of inorganic and organic anions in nickel-plating baths, cations in nickel-iron-cobalt-plating baths and metal-EDTA complexes in plating bath waste. Sample preparation was minimal, consisting merely of diluting the sa...
متن کاملPulse and pulse reverse plating—Conceptual, advantages and applications
A review on pulse and pulse reverse techniques for electrodeposition have been attempted. Pulse electrodeposition (PED) of some metals and lloys are reported. The effects of mass, transport, electrical double layer pulse parameters and current distribution on surface roughness and orphology are presented. Applications, advantages and disadvantages of PC and PRC techniques are discussed along wi...
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ژورنال
عنوان ژورنال: Journal of The Surface Finishing Society of Japan
سال: 2007
ISSN: 0915-1869
DOI: 10.4139/sfj.58.45